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Intel ready for an interconnected world

Intel believes that integrated computing and smart connected devices will fuel the next era of computing.

Intel Corporation's president Rene James said at the Computex event, held earlier this month, that the lines between technological categories were blurring as integrated computing was taking hold where form factor mattered less than the experience delivered once all devices were connected to each other and to the cloud.

Whether it's a smartphone, a smart shirt, an ultra-thin 2 in 1 or a new cloud service delivered to smart buildings outfitted with connected systems, Intel and the Taiwan ecosystem have joined together to accelerate and deliver the value of a smart, seamlessly connected and integrated world of computing.

"Processor technology continues to get smaller with greater performance and lower power thanks to Moore's Law, expanding the scale and potential for Intel technology and that of the Taiwan ecosystem, from infrastructure for cloud computing and the Internet to personal and mobile computing and wearable technology," James said.

She added that Intel technologies, products and collaborations with Taiwan and the broader ecosystem aimed to make a new wave of computing devices smart, integrated and connected to each other.

"Intel's commitment is to deliver a broad choice of SoC and communications options for tablets and smartphones across a range of form factors, price points and operating systems," James said.

Intel currently has 130 tablet design wins that are either in market or will enter the market this year, from global OEMs and ODMs. More than a dozen Intel-based tablets are launching in the Computex timeframe.

Approximately 35 per cent of Intel Atom processor-based tablet designs currently include or will include Intel communications solutions.

James also said the category 6-capable Intel XMM 7260 LTE-Advanced platform is now shipping to customers for interoperability testing and emphasised this puts Intel into a leadership position. This new technology is expected to appear in devices in the months ahead.

She also revealed the world's first 14-nanometre fanless mobile PC reference design from Intel. The 2-in-1 is a 12.5-inch screen that is 7.2mm thin with keyboard detached and weighs 670 grams. It includes a media dock that provides additional cooling for a burst of performance. Product shipments begin this month.


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